Panel for forming a floor covering, method for manufacturing such panels and granulate applied herewith
US11299893B2 · kind B2 · utility
9Cited by
3References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Mar 4, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24868
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A panel for forming a floor covering, where this panel includes a substrate including at least a layer of thermoplastic material, where the panel, above the layer, comprises at least also a printed décor and a translucent or transparent wear layer. The layer also includes at least individual fibers having a length greater than 1 millimeter, where the individual fibers are loose and freely distributed within the layer of thermoplastic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.