Patent · US Active

Device and method for increasing the thermal output of a heat source

US11300334B2 · kind B2 · utility

0Cited by

1References

12Claims

0Family size

Assignee

Siemens Energy Global GmbH & Co. KG · DE

Inventors

Jochen Schäfer · Bietigheim-Bissingen, DE
Florian Reissner · Nuremberg, DE

Key dates

Filing date	Apr 30, 2018
Grant date	Apr 12, 2022
Priority date	—
Expiry date	Aug 30, 2038

Classification

Technology area (CPC F)Mechanical Engineering; Lighting; Heating
CPC primaryF25B41/40
WIPO fieldThermal processes and apparatus
WIPO sectorMechanical engineering

Abstract

Various examples include a device for increasing the heat yield of a heat source comprising: a heat sink; a heat pump with a condenser and an evaporator; and the heat source. The heat sink includes a heat sink feed and a heat sink return providing thermal coupling to the heat source with a heat exchanger. The heat source includes a heat source feed and a heat source return for thermal coupling to the heat sink with the heat exchanger. The condenser of the heat pump is thermally coupled to the heat sink feed to dissipate heat to the heat sink. The evaporator of the heat pump is thermally coupled to the heat source return downstream of the heat exchanger to absorb heat.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.