Patent · US Active

Heat sink assembly for electronic equipment

US11300363B2 · kind B2 · utility

3Cited by

11References

20Claims

0Family size

Assignee

Cisco Technology, Inc. · US

Inventors

Rohit Dev Gupta · Bengaluru, IN
Tilak Gaitonde · Bengaluru, IN
Prashanth Pavithran · Bengaluru, IN

Key dates

Filing date	Jul 7, 2020
Grant date	Apr 12, 2022
Priority date	—
Expiry date	Jul 7, 2040

Classification

Technology area (CPC F)Mechanical Engineering; Lighting; Heating
CPC primaryF28D2021/0029
WIPO fieldThermal processes and apparatus
WIPO sectorMechanical engineering

Abstract

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.