Fingerprint recognition unit and fabrication method thereof, fingerprint recognition module and display device
US11301082B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2021 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Apr 28, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.