Metal smart card with dual interface capability
US11301744B2 · kind B2 · utility
2Cited by
8References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Jul 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A transaction card comprising a metal layer. A first cut out region in a first surface of said metal layer has a depth less than the thickness of the metal layer, and a first portion of an integrated circuit (IC) module is secured therein. A second cut out region extends from the first cut out region to the second surface of said metal layer and defines a non-RF-impeding volume having a perimeter greater than the perimeter of the first cut out region. One or more additional layers are stacked on the second surface of the metal layer, and a channel extends between one of the stacked layers and the IC module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.