Wiring harness assembly having multiple separated conductors embedded within a substrate
US11302460B2 · kind B2 · utility
1Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Aug 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/26
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A wiring harness assembly includes a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, a location feature integrally formed with the substrate, and an opening defined in the substrate located within a predetermined tolerance relative to the location feature. A section of the plurality of electrically conductive wires is exposed within the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.