Patent · US Active

Package assembly and method for manufacturing the same, package assembly of buck converter

US11302595B2 · kind B2 · utility

0Cited by

4References

19Claims

0Family size

Assignee

Hefei Silergy Semiconductor Technology Co., Ltd. · CN

Inventors

Ke Dai · Beijing, CN
Jian Wei · Kunshan, CN
Jiajia Yan · Zhejiang, CN

Key dates

Filing date	Sep 18, 2020
Grant date	Apr 12, 2022
Priority date	—
Expiry date	Sep 18, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH02M3/003
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package assembly can include: a die electrically connected to outer pins of the package assembly; an electronic component located above the die and electrically connected to the die, wherein the electronic component is connected to the outer pins of the package assembly through conductive pillars; and a heat dissipation structure located between the die and the electronic component to facilitate heat dissipation of the electronic component, where the heat dissipation structure physically isolates the die and the electronic component such that electromagnetic interference from the electronic component to the die is substantially prevented.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.