Semiconductor device, and power conversion device including the semiconductor device
US11302597B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2017 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Sep 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M7/537
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided with a heat dissipating face side skirt portion, which is a frame-form projection, on a heat dissipating face of a lead frame. Because of this, creepage distance increases with a small increase in an amount of resin, and insulating properties improve. Also, the heat dissipating face side skirt portion is molded via two transfer molding steps, wettability of the second molding resin with respect to a first molding resin and the lead frame increases, and adhesion improves. Furthermore, an end face of an inner lead is exposed in an element sealing portion on a mounting face side, and covered with a second thin molded portion molded using the second molding resin, whereby heat generated in a semiconductor element can efficiently be caused to escape from faces of both a first thin molded portion and the second thin molded portion, because of which heat dissipation improves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.