Lead frame wiring structure and semiconductor module
US11302612B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 30, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Oct 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame wiring structure including first and second bonding parts positioned apart from each other, and a coupling part extending in a first direction to couple the first and second bonding parts. The coupling part includes a coupling face section, and first and second leg sections extending respectively from two opposite end portions of the coupling face section toward the first and second bonding parts. The first bonding part includes a wide section having a side edge portion and a peripheral section adjacent to the side edge portion in a second direction, and a narrow section protruding in the first direction from the side edge portion. In the coupling part, the coupling face section is spaced apart from the two bonding parts in a third direction, and the first leg section is connected to the peripheral section of the first bonding part. The first to third directions are perpendicular to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.