EMI shield for molded packages
US11302648B2 · kind B2 · utility
0Cited by
13References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Jun 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.