Semiconductor device including vertically stacked semiconductor dies
US11302673B2 · kind B2 · utility
1Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Mar 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06586
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed including one or more stacks of semiconductor dies vertically molded together in an encapsulated block. The semiconductor dies may comprise memory dies, or memory dies and a controller die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.