Semiconductor device package and light source device
US11302853B2 · kind B2 · utility
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1References
21Claims
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Key dates
| Filing date | Jul 27, 2018 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Dec 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
Abstract
A semiconductor device package provided in an embodiment comprises: first and second frames spaced apart from each other; a body disposed between the first and second frames; and a semiconductor device disposed on the first and the second frame and comprising a semiconductor layer and a first and a second electrode on the semiconductor layer, wherein the first and the second frame comprise a first metal layer having a plurality of pores, and the first metal layer of the first and the second frame may comprise coupling portions in regions where the first metal layer overlaps the first and the second electrode, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.