Manufacturing method of via-hole connection structure, array substrate and manufacturing method thereof, display device and manufacturing method thereof

US11302869B2 · kind B2 · utility

Assignee

• BOE Technology Group Co., Ltd. · CN

Inventors

• Pengcheng Lu · Beijing, CN
• Xiaochuan Chen · Beijing, CN
• Shengji Yang · Beijing, CN
• Kuanta HUANG · Beijing, CN
• Hui Wang · Beijing, CN
• Yanming Wang · Beachwood, US
• Weihai Wang · Beijing, CN
• Guohong Qin · Beijing, CN
• Yage Song · Beijing, CN
• Jiantong Li · Beijing, CN

Key dates

• Filing date: Dec 26, 2018
• Grant date: Apr 12, 2022
• Expiry date: Jan 4, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/1201
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A manufacturing method of a via-hole connection structure, a manufacturing method of an array substrate and an array substrate are provided by the embodiments of the present disclosure, and the manufacturing method of the via-hole connection structure includes: forming an insulation layer on a base substrate and forming a first via hole in the insulation layer; forming a connection portion in the first via hole; forming a protection layer covering the connection portion on a surface of the insulation layer; forming a second via hole in the insulation layer and in the protection layer; removing at least a portion of the protection layer to expose the connection portion.