Patent · US Active

Heat dissipation assembly and action camera

US11303784B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

SZ DJI TECHNOLOGY CO., LTD. · CN

Inventors

Shengjia GUO · Lo Wu, CN
Guisheng Nong · Lo Wu, CN
Kunpeng Jing · Beijing, CN

Key dates

Filing date	Jun 11, 2020
Grant date	Apr 12, 2022
Priority date	—
Expiry date	Jun 11, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH04N23/55
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An action camera includes an external housing and a main chip disposed inside the external housing. The action camera also includes a heat dissipation assembly configured to dissipate heat from at least one heat generating component of the action camera. The at least one heat generating component includes the main chip. The heat dissipation assembly includes a heat tube and a first heat dissipation panel. An evaporation end and a condensation end of the heat tube are both in thermal contact with the first heat dissipation panel. The condensation end of the heat tube is disposed farther away from the main chip relative to the evaporation end of the heat tube. The first heat dissipation panel is configured to be in thermal contact with the main chip and the external housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.