Housings and associated design features for ceiling array microphones
US11303981B2 · kind B2 · utility
2Cited by
600References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Mar 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/021
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Housings and associated mechanical and ornamental design features directed to ceiling-mounted electro-acoustical components, such as array microphones, for example, for use in a suspended ceiling, are provided. In an embodiment, a housing for a ceiling array microphone is configured for mounting the microphone within a grid system of a suspended ceiling. The housing comprises a mounting element for mounting the housing within the grid system. The mounting element includes a lipped portion positioned approximate a periphery of the housing and configured to engage the grid when the housing is mounted with the grid system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.