Three-dimensional printing
US11304313B2 · kind B2 · utility
0Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2017 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Jan 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.