High-efficiency thermal management system and method
US11304343B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Dec 18, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Dec 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A high-efficiency electronic thermal management system and method providing a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface mounted in thermal communication with a heat source. The lower block having an inclined upper surface configured to be in thermal communication with a block directly above, having a complemental inclined surface. These blocks are elastically coupled. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block, and to a cold plate cooling source. The cold plate also has internal fins and flowing liquid for heat dispersion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.