Selective laser sintering device

US11305456B2 · kind B2 · utility

Assignee

• Huazhong University of Science and Technology · CN

Inventors

• Yusheng Shi · 红钢城街道, CN
• Chunze Yan · 红钢城街道, CN
• Zhaoqing Li · 红钢城街道, CN
• Peng Chen · Pittsburgh, US
• Zhufeng Liu · 红钢城街道, CN
• Jiamin Wu · Penndel, US
• Shifeng Wen · 红钢城街道, CN
• Chenhui LI · Hubei, CN
• Lichao Zhang · Shanghai, CN

Key dates

• Filing date: Oct 16, 2019
• Grant date: Apr 19, 2022
• Expiry date: May 8, 2040

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C16/24
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A selective laser sintering (SLS) device. The SLS device includes a laser forming unit, a support platform and a driving mechanism. The support platform is configured to support a plurality of raw materials for additive manufacturing of an object including a plurality of sections. The laser forming unit is disposed on the support platform and is configured to lay powders on a surface of each section of the object and sinter the powders. The driving mechanism is disposed under the laser forming unit and includes a vertical driving mechanism and a horizontal driving mechanism. The vertical driving mechanism is connected to the laser forming unit and configured to lift the laser forming unit layer by layer. The horizontal driving mechanism is configured to drive the laser forming unit to move in a horizontal direction with respect to the support platform.