Sputtering targets and devices including Mo, Nb, and Ta, and methods
US11306388B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Aug 29, 2018 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Jun 7, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Sputtering targets including molybdenum, niobium and tantalum are found to be useful for sputtering films for electronic devices. Sputtering targets with about 88 to 97 weight percent molybdenum show improved performance, particularly with respect to etching, such as when simultaneously etching an alloy layer including the Mo, Nb, and Ta, and a metal layer (e.g., an aluminum layer). The targets are particularly useful in manufacturing touch screen devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.