Method for processing product layer
US11309179B2 · kind B2 · utility
0Cited by
0References
18Claims
0Family size
Assignees
Inventor
Key dates
| Filing date | Jul 9, 2020 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Jul 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67063
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for processing a product layer includes providing a dielectric layer over a substrate, etching to remove a portion of the dielectric layer, forming a product layer over the etched dielectric layer, and removing the product layer by providing a dissolving solution and using the dissolving solution to rinse or soak the product layer to dissolve the product layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.