Wafer holder and wafer transfer apparatus, system and method
US11309209B2 · kind B2 · utility
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1References
29Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 29, 2018 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | May 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.