Patent · US Active

Stackable electronic package and method of fabricating same

US11309304B2 · kind B2 · utility

0Cited by

13References

5Claims

0Family size

Assignee

General Electric Company · US

Inventors

James Sabatini · Scotia, US
Christopher James Kapusta · Duanesburg, US
Glenn Forman · Niskayuna, US

Key dates

Filing date	Apr 18, 2018
Grant date	Apr 19, 2022
Priority date	—
Expiry date	Jun 4, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.