Manufacturing method for LED substrate and LED substrate
US11309472B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 10, 2020 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Jul 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
Abstract
The present disclosure provides a manufacturing method for an LED substrate and the LED substrate, the manufacturing method for the LED substrate includes following steps: S1: preparing a carrier substrate, disposing riveting points on preset positions of the carrier substrate; S2: sintering conductive lines on the carrier substrate, and covering an outer periphery of each riveting point with connecting ends of the conductive lines; and S3: riveting terminal pins to the riveting points, combining the terminal pins with the carrier substrate, and forming a conductive connection between the terminal pins and the connecting ends of the conductive lines. Compared with a traditional manufacturing method of the LED substrate, in a manufacturing process, steps of silver paste spot coating, silver paste high-temperature sintering and the like are reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.