Encapsulation structure, and display apparatus

US11309520B2 · kind B2 · utility

Assignees

• Chengdu BOE Optoelectronics Technology Co., Ltd. · CN
• BOE Technology Group Co., Ltd. · CN

Inventors

• Tingliang Liu · Beijing, CN
• Yunsheng Xiao · Beijing, CN
• Xiangdan Dong · Beijing, CN
• Yue Long · Beijing, CN
• Kai Zhang · Shanghai, CN
• Yonglin GUO · Beijing, CN
• Hongwei Ma · Beijing, CN

Key dates

• Filing date: Apr 10, 2019
• Grant date: Apr 19, 2022
• Expiry date: Nov 7, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/871

Abstract

An encapsulation structure includes a first inorganic layer, a first organic layer and a second inorganic layer, all of which are sequentially stacked in a thickness direction of the encapsulation structure. At least one of the first inorganic layer or the second inorganic layer is a crack-resistant layer.