Camera module and calibration method thereof
US11310403B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 22, 2019 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Apr 22, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B7/021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera module includes a substrate, a sensing chip, a lens module and a piezoelectric plate. The sensing chip is electrically connected with the substrate. The sensing chip includes a sensing region. The sensing chip is covered by the lens module. The sensing chip is arranged between the substrate and the lens module. When an external light beam passes through the lens module and projected on the sensing region, the sensing chip generates an image. The piezoelectric plate is arranged between the substrate and the lens module. When an electric power is provided to the piezoelectric plate, the piezoelectric plate is subjected to deformation, so that the lens group focuses on the sensing region. The present invention also provides a calibration method for the camera module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.