Patent · US Active

Multi-zone heat sink for printed circuit boards

US11310903B2 · kind B2 · utility

0Cited by

11References

7Claims

0Family size

Assignee

dSPACE digital signal processing and control engineering GmbH · DE

Inventors

Robert Breicher · Paderborn, DE
Van Son Nguyen · Warendorf, DE
Johannes Henkel · Paderborn, DE

Key dates

Filing date	Dec 21, 2020
Grant date	Apr 19, 2022
Priority date	—
Expiry date	Dec 21, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/066
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.