Memory device including a conductive plate with a shielding region
US11310905B2 · kind B2 · utility
3Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2020 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Mar 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a memory device. The memory device includes a module board on which one or more semiconductor devices are disposed and a conductive plate mounted on a first side of the module board. The conductive plate includes a shielding region and a non-shielding region. A pad is disposed in the shielding region of the conductive plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.