High-current circuit
US11310912B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2019 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Oct 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10272
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
High-current circuit having a printed circuit board comprising a non-conductive substrate 2, a conductor layer 4 applied to the substrate 2 and an insulation layer 6 applied to the conductor layer, contact pads 8, 10, 12, 20, 22, 24 in each case interrupting the insulation layer 6 being arranged on both sides of the conductor plate, and the contact pads 8, 10, 12, 20, 22, 24 making contact with one another via vias 14 through the substrate 2, and the vias 14 being arranged in the area of the contact pads 8, 10, 12, 20, 22, 24, 10, 12, 20, 22, 24, characterized in that at least a first one of the contact pads 8 is arranged on a first side of the printed circuit board and a first semiconductor switch 28 is connected directly to at least a second one of the contact pads 20 on a second side of the printed circuit board, and in that the semiconductor switch 28 is connected to the first contact pad 8 directly via the vias 14 and the second contact pad 20, without further conductor tracks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.