Method for producing a connection contact
US11310919B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | May 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10962
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a connection contact for a sensor or an actuator of a vehicle, the method including: providing a printed circuit board having at least one electronic component arranged thereon and having an opening; inserting a contact bushing into the opening; and combined soldering the at least one component to the printed circuit board and the contact bushing to the printed circuit board in one task. Also described are a related circuit board and a vehicle control unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.