Circuit board, method for manufacturing the same, and backlight
US11310920B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 30, 2019 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Nov 25, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board (100) includes an insulating base layer (11), a first conductive circuit layer (40) disposed on the base layer (11); a solder mask layer (60) covering the first conductive circuit layer (40) away from the base layer (11), wherein the solder mask layer (60) defines a slot (601), the slot (601) exposes a portion of the first conductive circuit layer (40), the solder mask layer (60) includes a sidewall (602) at the slot (601); and a cover film (70) covering the solder mask layer (60), wherein the cover film (70) defines an opening (701), the opening (701) corresponds to the slot (601) and exposes the solder pad (7401), the cover film (70) includes a covering portion (74) and a side reflecting portion (75), the covering portion (74) is disposed on the solder mask layer (60), the side reflecting portion (75) is connected to the covering portion (74) and covers the sidewall (602).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.