Thermal modules for electronic devices
US11310936B2 · kind B2 · utility
2Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2018 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | May 31, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0275
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.