Impinging jet manifold for chip cooling near edge jets
US11310937B2 · kind B2 · utility
0Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2020 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Jun 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20218
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.