Diamond composites by lithography-based manufacturing
US11311850B2 · kind B2 · utility
1Cited by
1References
9Claims
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Key dates
| Filing date | Aug 25, 2016 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Aug 8, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A lithography based method for the manufacture of diamond composite materials in which green bodies are prepared by a layer-by-layer construction with resulting green bodies de-bound and sintered to achieve a dense high hardness material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.