Sapphire collector for reducing mechanical damage during die level laser lift-off
US11311967B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2015 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Feb 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure. The Sapphire Collector includes a vacuum-enhance collector with a pickup element that lifts each released chip into the collector, and air pushers that direct the chips further into the collection tunnel leading to a discard bin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.