System and method for sub micron additive manufacturing
US11312067B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2017 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Jun 7, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus is disclosed for performing an additive manufacturing operation to form a structure by processing a photopolymer resist material. The apparatus may incorporate a laser for generating a laser beam, and a tunable mask for receiving the laser beam which has an optically dispersive element. The mask splits the laser beam into a plurality of emergent beams each having a subplurality of beamlets of varying or identical intensity, with each beamlet emerging from a unique subsection of illuminated regions of the mask. A collimator collimates at least one of the emergent beams to form a collimated beam. One or more focusing elements focuses the collimated beam into a focused beam which is projected as a focused image plane on or within the resist material. The focused beam simultaneously illuminates a layer of the resist material to process an entire layer in a parallel fashion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.