Resins, multilayer films and packages comprising the same
US11312119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2018 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Jul 13, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides resins for use as a sealant layer in a multilayer film, multilayer films, and packages formed from such films. In one aspect, a resin for use as a sealant layer in a multilayer film comprises (a) 10 to 30 weight percent low density polyethylene based on the total weight of the resin; (b) 60 weight percent or more of a random copolymer polypropylene based on the total weight of the resin; and (c) 5 to 25 weight percent of a crystalline block copolymer composite (CBC) comprising: i) a crystalline ethylene based polymer (CEP) comprising at least 90 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP); and iii) a block copolymer comprising (1) a crystalline ethylene block (CEB) comprising at least 90 mol % polymerized ethylene and (2) a crystalline alpha-olefin block (CAOB).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.