Printed circuit board design and manufacturing
US11314229B2 · kind B2 · utility
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2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2019 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Jul 19, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.