Modular heat sink supporting expansion card connector
US11314294B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2020 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Dec 9, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/0042
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.