Multilayer electronic component
US11315730B2 · kind B2 · utility
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2References
12Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 3, 2020 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Aug 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component having an electrode facing portion in which a plurality of internal electrode layers face one another with a dielectric layer interposed therebetween. Each dielectric layer includes Ba, Ti, Si, Re, and M. M is at least one element selected from Mn, Ni, Co, Fe, Cr, Cu, Mg, Li, Al, Mo, W, and V. When the Ti is represented in an amount of 100 parts by mole the dielectric layer at the electrode facing portion has Si in an amount a of 0.01≤a≤0.1, Re in an amount b of 0.1≤b≤3.0, and M in an amount c of 0.2≤c≤5.0. A ratio m of the amount of Ba to the amount of Ti is 0.965≤m≤0.990.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.