Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor
US11315734B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2020 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Apr 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/2325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic capacitor includes a capacitive element including ceramic layers and internal electrodes, and external electrodes on the capacitive element. The external electrodes include a Ni underlying electrode layer mainly made of Ni, a Cu plating electrode layer, and at least one second plating electrode layer. The Cu plating electrode layer includes a Ni diffused Cu plating electrode layer on a side closer to the Ni underlying electrode layer and including Ni diffused therein and a non-Ni diffused Cu plating electrode layer on a side closer to the second plating electrode layer and not including Ni diffused therein. The Cu plating electrode layer has a thickness of about 3 μm or more and about 12 μm or less and the non-Ni diffused Cu plating electrode layer has a thickness of about 0.5 μm or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.