Patent · US Active

Alignment mark, substrate and manufacturing method therefor, and exposure alignment method

US11315882B2 · kind B2 · utility

0Cited by

10References

13Claims

0Family size

Assignees

Ordos Yuansheng Optoelectronics Co., Ltd. · CN
BOE Technology Group Co., Ltd. · CN

Inventors

Qinglin Ma · Woodinville, US
Baojie Zhao · Beijing, CN
Conghui Zhou · Beijing, CN
Li Wang · Beijing, CN
Jian Li · Beijing, CN
Yan Zhao · Beijing, CN
Xiang HUI · Beijing, CN
Xiongwei Wang · Hino, JP
Chunhong MA · Beijing, CN

Key dates

Filing date	Sep 7, 2018
Grant date	Apr 26, 2022
Priority date	—
Expiry date	Feb 25, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2223/54493
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An alignment mark includes an alignment region, a peripheral region and a shielding region. The alignment region has an outer contour; the peripheral region is disposed around at least a part of the outer contour of the alignment region; the shielding region is disposed around at least a part of the outer contour of the alignment region and is non-overlapped with the peripheral region; and the alignment region and the shielding region are opaque, and the peripheral region is at least partially transparent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.