Thermal radiation body for cooling heating element and method for manufacturing the same
US11316059B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
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Key dates
| Filing date | Jun 28, 2019 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/52
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present inventive concept relates to a thermal radiation body for cooling a heating element, which includes a pattern unit including a pore part provided as an empty space or filled with a gas phase and a cover part covering the pore part and dissipates heat of the heating element through heat radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.