Optoelectronic semiconductor component, and method for producing an optoelectronic semiconductor component

US11316075B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Jörg Erich Sorg · Regensburg, DE
• Christoph Koller · Nittendorf, DE
• Andreas Dobner · Wenzenbach, DE

Key dates

• Filing date: Oct 8, 2018
• Grant date: Apr 26, 2022
• Expiry date: Jun 23, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8515
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6). Finally, the housing (3) comprises a radiation exit region (34) for emitting radiation.