Reflective and heat-insulating QLED package device and method for packaging the same as well as luminaire
US11316088B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2018 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Aug 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A reflective and heat-insulating QLED package device and a method for packaging the same as well as a luminaire are provided. The reflective and heat-insulating QLED package device includes a substrate, a first LED chip for emitting blue light, a second LED chip for emitting green light, an adhesive layer for quantum dots, a reflecting layer for changing the path of light rays, and a heat-insulating layer. The first LED chip and the second LED chip are arranged on the substrate in a tiled manner. The heat-insulating layer is arranged on the light output surface of the first LED chip and the second LED chip, a reflecting layer covers the heat-insulating layer, and a reflecting substance or a refractive substance is uniformly distributed in the reflecting layer. The adhesive layer for quantum dots covers the reflecting layer and is covered by a moisture and oxygen blocking adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.