Display device with multiple hardening layers and manufacturing method thereof
US11316132B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2019 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Apr 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/1201
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, a thin film transistor (TFT) device layer, a luminescent device layer, and a thin film encapsulation layer, wherein the thin film encapsulation layer includes a first inorganic layer, a first hardening layer disposed on the first inorganic layer, a second inorganic layer disposed on the first hardening layer, an organic planarization layer disposed on the second inorganic layer, a second hardening layer disposed on the organic planarization layer, a third inorganic layer disposed on the second hardening layer, and a third hardening layer disposed on the third inorganic layer, thereby realizing a cover window and encapsulation structure characteristics at the same time, and achieving ultra-thin encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.