Method for producing electrical connections
US11317518B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Sep 2, 2019 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Nov 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10303
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided to produce electromechanical interconnections within integrated circuits (ICs), printed circuit boards (PCBs) and between PCBs and other electronic components such as resistors, capacitors and integrated circuits. Elements include so-called “smart pins” or “neuro-pins” that facilitate electrical pathways in the dimension normal to the plane of a PCB. Smart pins or neuro-pins may be inserted using automated processes that do not require the high temperatures normally associated with soldering. Resultant circuits generally contain a large number of layers that are more compact and more readily constructed compared with conventional PCB-based circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.