Microwave sensing in additive manufacturing
US11318537B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Jan 31, 2017 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Aug 15, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for additive manufacturing (AM) including forming a product via AM, placing a resonator adjacent the product as the product is being formed in the AM, and determining a property of the product. The resonator operates over a microwave frequency spectrum and emanates electromagnetic energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.