System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11318550B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Apr 22, 2020 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Apr 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.