Molding apparatus and process
US11318639B2 · kind B2 · utility
0Cited by
24References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2020 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Nov 5, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2317/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding process includes the operation of placing insulation material comprising fibers and binder on the fibers in a mold cavity. The molding process further includes the step of transferring heat to the insulation material to cause the binder to cure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.