Patent · US Active

Spunbond laminate

US11318712B2 · kind B2 · utility

0Cited by
1References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 28, 2020
Grant dateMay 3, 2022
Priority date
Expiry dateJul 28, 2040

Classification

  • Technology area (CPC D)Textiles; Paper
  • CPC primaryD10B2331/04
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A spunbond nonwoven laminate has a first spunbond nonwoven layer having crimped filaments formed by a first component on an outer surface of the filaments of the first layer consisting or substantially consisting of a polyolefin and a second component consisting or substantially consisting of a plastic having a higher melting point than the polyolefin of the first component of the filaments of the first layer. A second outermost spunbond nonwoven layer on the first layer having filaments as a cover layer and formed by a first component on an outer surface of the filaments of the second layer consisting or substantially consisting of a polyolefin, and a second component consisting or substantially consisting of a plastic having a higher melting point than the polyolefin of the first component of the filaments of the second layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.